Atomic diffusion modeling and Investigation of joining properties of TLP in AA2024 to AA6061 alloys

In this study, to bond AA2024 and AA6061 alloys to each other, three elements (Sn, Zn and Ga)  were considered as interlayer elements in terms of atomic diffusion depth in the base metal and storage at 453°C for 2 days, 10 hours, 210 minutes, and 30 seconds that they were examined for atomic diffusion modeling. Finally, the two alloys were connected at a temperature of 453°C in a furnace environment under a vacuum of 7.5×10-13 Torr under a transient liquid phase process. The effect of changing the thickness of the interlayer on the connection of the two alloys are examined with practical tests such as metallography, SEM, the distribution map of the elements, hardness test, the linear scan of the elements at the joint, and tensile strength test in two modes, 1: investigating the effect of changing the thickness of the interlayer on strength, and 2: investigating the change in joint strength by increasing sample retention time in the furnace. As the thickness of the interlayer increases (from 20 to 70 μm), the bond strength decreases. The maximum tensile strength of joint with the 20 μm thickness Sn-5.3Ag-4.6Bi interlayer is 52 MPa.